The ECT µHPC/GA contactor provides a high-yield, high-volume, production-proven test solution for grid array integrated circuit packages. Peripherally leaded packages with ground slugs may also use µHPC/GA contactors. The conductive path of the µHPC/GA contactor consists of a solid conductive contact element which contacts the DUT, and Surface Mount Matrix (SMM) which provides both contact to the performance board and the necessary compliance. These two components combine to yield outstanding electrical and mechanical performance. ECT µHPC/GA contactors have been used successfully in demanding applications such as wireless communications, Rambus, low-noise analog, and ultra high-speed logic.

In summary, the ECT µHPC/GA contactor allows flexible testing for a wide range of device types, while providing outstanding electrical and mechanical performance.