Introducing the Snap 2™, a pneumatically actuated conductive rubber shorting device for use in ECT’s ValuGrid® test fixture for testing bare printed circuit boards with pitches of less than 10 mil. The Snap 2™ is available in two sizes (see specs).

The Snap 2™ Module provides solutions for testing boards with ultra fine center pad spacing, such as designs using tape automated bonding (TAB), flip chip and micro ball grid array sites, which present very significant challenges in electrical test. The Snap 2™ device represents a significant technology advancement for testing ultra fine centers.

ECT’s ValuGrid® Merlin™ fixturing software automatically locates the Snap 2™ Module at appropriate device sites, routes the pneumatic tubing, and segments the test program. Boards are placed on a single fixture and tested in one pass. The Snap 2™ is only engaged when the board is tested for continuity, not when it’s being tested for isolation. For boards with multiple ultra fine center device sites, the Snap 2™ can be engaged sequentially to increase fault coverage.

The module literally snaps into ECT’s ValuGrid® fixture, and can be easily removed and reused. A variety of tops are available. The Snap 2™ requires a software and hardware upgrade to the 9090 Series test system.

Cylinder Specifications
	Snap 2™	Mini Snap 2™
Bore Size	.437" (11.100 mm)dia.	.312" (7.952 mm)
Maximum Stroke	.50" (12.700 mm)	.50" (12.700 mm)
Rod Material	303 Stainless Steel	303 Stainless Steel
Base Weight	0.04 lbs. (0.18 kg)	0.03 lbs. (0.14 kg)
Force Exerted	0.15 (0.90 kg) air line Pressure	0.07 air line Pressure
Clearance Hole Size
	.500" (12.700 mm) dia.	.380 (9.525 mm) dia.
Recommended Air Pressure
	90 psi	90 psi